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optical_lithography

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Description

Warnings

  1. Don't make mess, clean everything after use.
  2. Switch off the lamp of the mask aligner, it has a limited lifetime.
  3. It is not allowed to take masks out of the cleanroom.

To start

  1. Because the UV lamp needs some time to warm up, you should switch on the mask aligner first.
    1. Switch on power and UV source.
    2. Wait for 10 minutes.
    3. In the meanwhile you can spincoat resist and bake it.
  2. Switch on the hot plate now (there is a switch at the left).
  3. Adjust temperature with large knob.
  4. Desired temperature depends on the kind of resist you use.

Spin coater

The spin coater has 2 standard recipes. To change recipe, you need to operate on the keyboard of the spin coater (that has no labels anymore). The keyboard has 10 buttons in 2 rows.

1 2
3 4
5 6
7 8
9 10

To change the recipe press the buttons in the following way:

  1. 1 edit.
  2. 10 change recipe.
  3. 7 (-) or 8 (+) to adjust.
  4. 2 end edit.
  5. use recipe 1 or 2 for optical resist.

Hot plate

  1. put the sample on the hot plate and time the process.
  2. the time you need depends on the kind of resist.

Mask aligner

  1. When you can see the blue light shining from the back, the lamp is warm.
  2. Put the mask in the mask holder, upside down, because in this way the side with the structure on it will be in contact with your sample.
  3. Slide the mask holder in the mask aligner and switch knob 'mask'.
  4. Put your sample in and align roughly.
  5. There are two handles at the left. The lower one should be set to 'contact'.
  6. Now you can turn the upper one.
  7. If the sample is not perfectly aligned, you can set the lower handle to 'separation' and adjust.
  8. When everything is OK, set the handle to 'contact' again.
  9. The exposure timer should be set to 15 seconds.
  10. Press exposure button and help the system a little bit if it doesn't move by itself.
  11. After exposure, turn left knob and remove sample.

Development

  1. Fill a glass with developer (which one depends on the resist) and one with water.
  2. Develop (usually 20-30 seconds).
  3. Rinse in water.
  4. Dry with N2 and be careful not to damage your structure.

When you're done

  1. Switch off the lamp of the mask aligner and the mask aligner itself.
  2. Switch off the hot plate.
  3. Clean the spin coater.
  4. Clean up the glasses you used for the developer. It is not necessary to put developer in the waste bottle.

Resists

Resist Spin coater Baking Developing
AZ5214E 4000/6000rpm 90 2.5 min 50% AZ312MIF + 50% H2O, 40 s
optical_lithography.1216903165.txt.gz · Last modified: 2008/07/24 12:39 by knaap

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