optical_lithography
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Table of Contents
Description
Warnings
- Don't make mess, clean everything after use.
- Switch off the lamp of the mask aligner, it has a limited lifetime.
- It is not allowed to take masks out of the cleanroom.
To start
- Because the UV lamp needs some time to warm up, you should switch on the mask aligner first.
- Switch on power and UV source.
- Wait for 10 minutes.
- In the meanwhile you can spincoat resist and bake it.
- Switch on the hot plate now (there is a switch at the left).
- Adjust temperature with large knob.
- Desired temperature depends on the kind of resist you use.
Spin coater
The spin coater has 2 standard recipes. To change recipe, you need to operate on the keyboard of the spin coater (that has no labels anymore). The keyboard has 10 buttons in 2 rows.
| 1 | 2 |
|---|---|
| 3 | 4 |
| 5 | 6 |
| 7 | 8 |
| 9 | 10 |
To change the recipe press the buttons in the following way:
- 1 edit.
- 10 change recipe.
- 7 (-) or 8 (+) to adjust.
- 2 end edit.
- use recipe 1 or 2 for optical resist.
Hot plate
- put the sample on the hot plate and time the process.
- the time you need depends on the kind of resist.
Mask aligner
- When you can see the blue light shining from the back, the lamp is warm.
- Put the mask in the mask holder, upside down, because in this way the side with the structure on it will be in contact with your sample.
- Slide the mask holder in the mask aligner and switch knob 'mask'.
- Put your sample in and align roughly.
- There are two handles at the left. The lower one should be set to 'contact'.
- Now you can turn the upper one.
- If the sample is not perfectly aligned, you can set the lower handle to 'separation' and adjust.
- When everything is OK, set the handle to 'contact' again.
- The exposure timer should be set to 15 seconds.
- Press exposure button and help the system a little bit if it doesn't move by itself.
- After exposure, turn left knob and remove sample.
Development
- Fill a glass with developer (which one depends on the resist) and one with water.
- Develop (usually 20-30 seconds).
- Rinse in water.
- Dry with N2 and be careful not to damage your structure.
When you're done
- Switch off the lamp of the mask aligner and the mask aligner itself.
- Switch off the hot plate.
- Clean the spin coater.
- Clean up the glasses you used for the developer. It is not necessary to put developer in the waste bottle.
Resists
| Resist | Spin coater | Baking | Developing | Remarks |
|---|---|---|---|---|
| AZ5214E | 4000/6000rpm | 90 C, 2.5 min | 50% AZ312MIF + 50% H2O, 40 s | - |
| HPR205 | 4000/6000rpm | 90 C, 2.5 min | 50% AZ312MIF + 50% H2O, 40 s | - |
| MaN1410 | 3000rpm,30-45 s | 90 C, at least 90 s | MaD533, 15 s | negative photoresist |
| MaP1205 | 4000/6000rpm | 100 C, 30 s | 90% MaD532 + 10% H2O, 30 s | 100% MaD532 can also be used, takes 10-15 s |
optical_lithography.1216903880.txt.gz · Last modified: 2008/07/24 12:51 by knaap