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--- atc-1800 [2023/03/21 12:54] – scholma
+++ atc-1800 [2025/02/18 15:15] (current) – [Flat Au films on Mica] wigbout
@@ Line 193: / Line 193: @@
 loading into ATC. Use a Cu holder for the mica, no adhesives
-Pressure
+  * Pressure: 20 mTorr setpoint, low -7 background
+  * Ar Flow: 24
-mTorr setpoint, low -7 background
+  * Temperature: 300deg C for deposition.
+  * Current: 200 mA for 20 minutes, then 2 minutes 45 mA
-Ar Flow
+  * Voltage: Around 500 / 380
+  * O2 flow: 1
+  * Heating/cooling rate: Heating: Heat up before deposition to 450  to bake out the dirt from chamber, holder & substrate. Radiative cooldown to 300 for deposition. Anneal for 1-2hrs postdeposition at 300. Cooldown radiative by switching off heat.
+  * RMS roughness (and better roughness data if available): I think a picture says more than 1000 roughness values. Picture: stm image in air, with a lot of vibrations. Image size 740x640 nm. Shows the typical variation of terrace sizes you find on these samples.
-Temperature
-deg C for deposition.
-Current
-mA for 20 minutes, then 2 minutes 45 mA
-Voltage
-Around 500 / 380
-O2 flow
-Heating/cooling rate
-Heating: Heat up before deposition to 450  to bake out the dirt from
-chamber, holder & substrate. Radiative cooldown to 300 for deposition.
-Anneal for 1-2hrs postdeposition at 300. Cooldown radiative by switching
-off heat.
-and
-RMS roughness (and better roughness data if available)
-I think a picture says more than 1000 roughness values..
-Picture: stm image in air, with a lot of vibrations. Image size 740x640
-nm. Shows the typical variation of terrace sizes you find on these
-samples.
 Note 1: This recipe has been taken over (mutatis mutandis) from the