atc-1800
Differences
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| Both sides previous revisionPrevious revisionNext revision | Previous revision | ||
| atc-1800 [2023/02/03 12:33] – scholma | atc-1800 [2025/02/18 15:15] (current) – [Flat Au films on Mica] wigbout | ||
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| ====== ATC Sputtering System manual ======= | ====== ATC Sputtering System manual ======= | ||
| + | {{ :: | ||
| ====== Description ====== | ====== Description ====== | ||
| Line 7: | Line 8: | ||
| ===== DONT's ===== | ===== DONT's ===== | ||
| * **Never make a modification** to the system without consulting a technician | * **Never make a modification** to the system without consulting a technician | ||
| - | * **Never transfer a hot sample holder** (cold is, say, 150 °C) | + | * **Never transfer a hot sample holder** (cold is, say, 50 °C) |
| * **Never hot-switch the switchbox** (switch off power first!) | * **Never hot-switch the switchbox** (switch off power first!) | ||
| * **Never exceed 50W RF power for substrate bias** | * **Never exceed 50W RF power for substrate bias** | ||
| Line 68: | Line 69: | ||
| - Open VAT-valve fully | - Open VAT-valve fully | ||
| - Switch off rotation | - Switch off rotation | ||
| - | - When the sample stage has cooled to <100°C, transfer your sample to loadlock | + | - When the sample stage has cooled to <50°C, transfer your sample to loadlock |
| ===== Removing the sample ===== | ===== Removing the sample ===== | ||
| Line 192: | Line 193: | ||
| loading into ATC. Use a Cu holder for the mica, no adhesives | loading into ATC. Use a Cu holder for the mica, no adhesives | ||
| - | Pressure | + | * Pressure: 20 mTorr setpoint, low -7 background |
| - | + | | |
| - | 20 mTorr setpoint, low -7 background | + | |
| - | + | | |
| - | Ar Flow | + | |
| - | + | | |
| - | 24 | + | |
| - | + | | |
| - | Temperature | + | |
| - | + | ||
| - | 300deg C for deposition. | + | |
| - | + | ||
| - | Current | + | |
| - | + | ||
| - | 200 mA for 20 minutes, then 2 minutes 45 mA | + | |
| - | + | ||
| - | Voltage | + | |
| - | + | ||
| - | Around 500 / 380 | + | |
| - | + | ||
| - | O2 flow | + | |
| - | + | ||
| - | 1 | + | |
| - | + | ||
| - | Heating/ | + | |
| - | + | ||
| - | Heating: Heat up before deposition to 450 to bake out the dirt from | + | |
| - | chamber, holder & substrate. Radiative cooldown to 300 for deposition. | + | |
| - | Anneal for 1-2hrs postdeposition at 300. Cooldown radiative by switching | + | |
| - | off heat. | + | |
| - | + | ||
| - | and | + | |
| - | + | ||
| - | + | ||
| - | + | ||
| - | RMS roughness (and better roughness data if available) | + | |
| - | + | ||
| - | I think a picture says more than 1000 roughness values.. | + | |
| - | + | ||
| - | + | ||
| - | + | ||
| - | Picture: stm image in air, with a lot of vibrations. Image size 740x640 | + | |
| - | nm. Shows the typical variation of terrace sizes you find on these | + | |
| - | samples. | + | |
| - | + | ||
| - | + | ||
| - | + | ||
| Note 1: This recipe has been taken over (mutatis mutandis) from the | Note 1: This recipe has been taken over (mutatis mutandis) from the | ||
atc-1800.1675427601.txt.gz · Last modified: 2023/02/03 12:33 by scholma